FloTron

FloTron™ systems use ‘sensors’ and ‘actuators’ to monitor and control accurately plasmabased
Physical Vapour Deposition (PVD) and Chemical Vapour Deposition (CVD) processes.
They are especially useful for controlling Reactive Magnetron Sputtering processes for
deposition of oxide, nitride and oxy-nitride layers.

Figure 1.  Basic FloTron^TM system configuration in a small reactive sputtering system.

Figure 2.  Typical FloTron^TM system configuration in large area 3-zone dual reactive magnetron sputtering process chamber.